The company's R&D team is composed of internationally renowned enterprises with R&D technology and management experience, leading talents of "mass entrepreneurship and innovation" in Jiangsu Province, and local R&D teams with rich R&D experience. The team members have rich experience in advanced semiconductor packaging field, such as fan-out, fan-in, chip flip, stacked packaging, silicon through-hole and other high-top fields. They have several independent intellectual property rights.