In 2019, it was approved by the Ministry of Science and Technology for the research ability of major special projects;

Passed ISO 9001 quality System certification in 2019;

Independently developed more than ten advanced packaging proprietary technology methods and technical secrets of integrated circuit;

The company started trial production of some products at the end of 2019, continued equipment installation and commissioning at the beginning of 2020, continuously improved production capacity and passed product verification of domestic and foreign customers, and reached the advanced packaging capacity of 10,000 12-inch wafers per month within this year.