System Simulation

The signal and power supply of high speed/high frequency substrates were analyzed

• SI：S Parameter extraction，RLCG  Parameter extraction、The time domain analysis 、Eye diagram analysis

• PI: Dc voltage drop analysis、AC Impedance analysis、Synchronous switching noise analysis

Simulation of silicon-based Interposer GSG structure

Simulation and test of system link structure

Power time domain simulation	Planar resonance simulation of power supply	Dc voltage drop simulation

Thermal simulation of structural stress

• Structural stress -- package structure selection and optimization, reliability and failure prediction, warping analysis

• Encapsulation heat simulation -- encapsulation junction temperature and heat resistance extraction, encapsulation heat dissipation scheme selection and optimization

• Simulation of plate-level and wafer level plastic sealing process -- Filling process analysis and defect prediction, process and material optimization

TSV转接板结构仿真	标准封装结温热阻提取	板级塑封工艺仿真
TSV转接 板结构仿真	封装散热优化	晶圆级塑封工艺仿真

Structural process simulation analysis

• Package warp prediction and structure optimizati

• Thermal stress and reliability simulation

• Analysis and defect prediction of plastic sealing process

Warping prediction for board level packaging	CPI reliability Analysis	Simulation and optimization of bottom filling process